Semiconductor and silicon related business

Process flow diagram of used silicon member

2. We purchase the used silicon material and bring it to the warehouse.
3. ② Measure and sort used silicon parts in our warehouse.
4. Pack the spent used silicon material at (2) our warehouse and export it to the Taiwanese subsidiary after customs clearance.
5. Taiwan branch office accepts the exported used silicon material (3).
6. ③ Measure the P / N of spent silicon at the Taiwan branch office, sort, clean, dissolve, and manufacture a new silicon ingot.
7. Import the newly made silicon ingot after customs clearance.
8. (4) Slice manufacturers designated by domestic manufacturers accept, process, and produce modules.

Single crystal ingot: The state before cutting out as a silicon wafer for semiconductor. It is used for soldering for semiconductors. Some are also used to make silicon parts.

Polysilicon: It is a material (about 5 to 6 cm in size) that makes semiconductor silicon ingots, but it is also used to improve the quality of solar wafers. Polysilicon is high-purity polycrystalline silicon. It is divided into two roughly. One is a semiconductor substrate and the other is a solar cell raw material. It becomes a semiconductor substrate used for mobile phones, flat-panel TVs, personal computers, etc. It is an IC chip. As a solar cell raw material, it is very increasingly used as a raw material for cells used in photovoltaic power generation equipment.

Pot scrap: It is a mass of silicon adhering to a quartz crucible when pulling up a semiconductor silicon ingot and it is reused as a solar battery.

Single crystal top & tail: It occurs when manufacturing a semiconductor silicon ingot, and cuts the top and bottom of the ingot. It is reused as a solar application.

Round Wafer: It is a circular wafer sliced by a semiconductor ingot, and it has bare, film, pattern and so on. Size is 3.4.5.6.8.12 inches various, conductive P type, N type, mixed P / N type.

Cracked wafer: It is a broken material broken from the round wafer, and the size is from 2 cm to 18 cm.

Cracked wafer: It is a broken material broken from the round wafer, and the size is from 2 cm to 18 cm.