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Semiconductor and silicon related business

Semiconductor and silicon related business

Process flow diagram of used silicon member

Details

    li> 1. ① manufacturer, domestic abroad. silicon ingot manufacturer from used silicon member. go out.
  • 2. We purchase the used silicon material and bring it to the warehouse.
  • 3. ② Measure and sort used silicon parts in our warehouse.
  • 4. Pack the spent used silicon material at (2) our warehouse and export it to the Taiwanese subsidiary after customs clearance.
  • 5. Taiwan branch office accepts the exported used silicon material (3).
  • 6. ③ Measure the P / N of spent silicon at the Taiwan branch office, sort, clean, dissolve, and manufacture a new silicon ingot.
  • 7. Import the newly made silicon ingot after customs clearance.
  • 8. (4) Slice manufacturers designated by domestic manufacturers accept, process, and produce modules.
Single crystal ingot
Single crystal ingot
The state before cutting out as a silicon wafer for semiconductor. It is used for soldering for semiconductors. Some are also used to make silicon parts.
Polysilicon
Polysilicon
It is a material (about 5 to 6 cm in size) that makes semiconductor silicon ingots, but it is also used to improve the quality of solar wafers. Polysilicon is high-purity polycrystalline silicon. It is divided into two roughly. One is a semiconductor substrate and the other is a solar cell raw material. It becomes a semiconductor substrate used for mobile phones, flat-panel TVs, personal computers, etc. It is an IC chip. As a solar cell raw material, it is very increasingly used as a raw material for cells used in photovoltaic power generation equipment.
Pot scrap
Pot scrap
It is a mass of silicon adhering to a quartz crucible when pulling up a semiconductor silicon ingot and it is reused as a solar battery.
Single crystal top & tail
Single crystal top & tail
It occurs when manufacturing a semiconductor silicon ingot, and cuts the top and bottom of the ingot. It is reused as a solar application.
Round Wafer
Round Wafer
It is a circular wafer sliced by a semiconductor ingot, and it has bare, film, pattern and so on. Size is 3.4.5.6.8.12 inches various, conductive P type, N type, mixed P / N type.
Cracked wafer
Cracked wafer
It is a broken material broken from the round wafer, and the size is from 2 cm to 18 cm.
Cracked wafer
Cracked wafer
It is a broken material broken from the round wafer, and the size is from 2 cm to 18 cm.
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